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Innovative Dissolvable and Degradable Materials Optimize Oil and Gas Extraction

Posted by Sealing & Shielding Team on 30 Apr 2019

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Parker's Innovative Dissolvable and Degradable Materials Optimize Oil and Gas Extraction_OES_Dissolvable_Packing_Elements_ORing_&_Engineered_Seals_DivisionDissolvable and degradable materials are used in oil and gas operations to create high pressures in hydraulically fractured wells, while also minimizing well intervention keeping wells flowing and preventing blockages. These materials are designed to withstand the high pressures and temperatures that are experienced during an application, and then gradually break down into tiny particles that do not need to be recovered. Because these materials naturally dissolve or degrade, operators are not required to run a wire line down the hole to drill them out — saving considerable time and reducing costs.

These innovative materials are gaining popularity in the oil and gas industry. As competition increases in the global energy market, producers seek technologies that will reduce costs and improve well efficiencies. It has been estimated that over the next two to three years, greater than 30 percent of well servicing and stimulation consumables will be dissolvable products (currently less than 10 percent).

 

Advantages of dissolvables and degradables

Innovative Dissolvable and Degradable Materials Optimize Oil and Gas Extracation, Frac Balls, Oil & Gas, OTCDissolvable metals and degradable elastomers replace the traditional composite products used in completion operations and can be customized to the application, including diameter, composition, strength, and rate of dissolution for common wellbore fluids. More operators are using aluminum-based materials because they are stronger than magnesium alloys, allowing much smaller overlaps (1.8 percent) in ball and seat applications. Thermoplastic elastomers have consistent high tensile strength and elongations for ambient and elevated temperatures, which provides customers with consistent performance over a wide range of temperatures. Parker’s degradable elastomers can be custom designed providing specific engineered shapes meeting the customer’s needs.

Advantages of dissolvables and degradables include:

  • Reduced operating costs. Less well intervention is required (no need to drill out), which also reduces the risk of damage to the casing.
  • Faster path to production of the well. Dissolvable materials can be formulated to allow for production to begin in as little as 48 hours after deployment, with no need to wait for a coil line crew.
  • High product performance to improve the overall completion performance of the well. Degradable materials can be used for pressures exceeding 10Ksi and temperatures exceeding 200°F, providing ideal frac conditions.
  • Highly engineered products that can be processed via multiple methods to produce desired shape. Parker provides multiple processing capabilities to produce products that can meet the specific needs of individual wells.
  • Opportunity for dual material use for product performance. A wide range of material offerings allows for combined use—for example, elastomer and thermoplastic can be bonded to the aluminum or used in combination.
Strong engineering and lab support

Parker's Innovative Dissolvable and Degradable Materials Optimize Oil and Gas Extraction_OffShore_Rig_EMG_GroupDissolvable metals and degradable thermoplastics and elastomers must perform in harsh, corrosive down-hole environments in oil and gas wells. Parker’s dissolvable and degradable products are made with metal, thermoplastics, and thermosets (elastomers), providing operators with a wider range of material options. For example, Parker offers frac balls in delayed-reaction coatings such as Teflon, nickel, and epoxy. Our 94-Series provides a smooth C2-inhibitive coating with no cracks, rough spots, or nodules, which reduces corrosion and extends life cycle.


Because of our comprehensive range of material offerings, Parker can be an operator’s single provider of dissolvable products, allowing customers to reduce their vendor base. Parker also provides customers with inventory management options, further streamlining operations. Proprietary rate of dissolution (ROD) calculators are derived from broad-spectrum dissolution testing on our dissolvable metal products and are a handy tool for optimizing frac design and product selection for specific well conditions.  

Parker engineers work with oil and gas design teams around the world to customize dissolvable and degradable materials for specific applications. Our proprietary materials are compounded in-house; this also allows us to provide quick-turn delivery production orders and sample requests in a matter of days, including optical inspection to ensure tight tolerances, custom labeling, laser marking, and packaging services.

Parker’s dedicated oil and gas sealing experts, dedicated development labs, and processing equipment are at the forefront of emerging applications for dissolvable/degradable technologies in the energy field. For more information, or to discuss your project needs with a Parker engineer, visit us at OTC, booth #3639. Not attending? Visit our webpage to learn more about our high-performance sealing materials for oil and gas applications. 

Now, watch this video to find out more.

 

Innovative Dissolvable and Degradable Materials Optimize Oil and Gas Extraction, Dana Severson, Oil & Gas, OTC

 

 

This article was contributed by Dana Severson, regional sales manager - oil & gas, Engineered Materials Group, Parker Hannifin.

 

 

 

 

 

Related content:

Advanced Material Development for High-Pressure/High-Temperature Oil & Gas Extraction

Do Your Seals Meet the Demands of the Oil and Gas Industry?

Custom Designed Packing Elements for the Most Challenging Applications

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  • Form-In-Place Gaskets: What They Are and What They Are Not - FIP Gaskets - Parker ChomericsForm-in-place EMI gaskets, also known as FIP EMI gaskets, is a robotically dispensed electromagnetic interference (EMI) shielding solution that is ideal for modern densely populated electronics packaging.

    The most important distinction of form-in-place EMI gaskets is that they were developed for applications where inter-compartmental isolation is required to separate signal processing and/or signal generating functions.

    Simply put, form-in-place gaskets are meant to reduce “noise” between cavities on a printed circuit board (PCB) or in an electronics enclosure. 

    In addition, form-in-place gaskets provide excellent electrical contact to mating conductive surfaces, including printed circuit board traces for cavity-to-cavity isolation. Parker Chomerics form-in-place gasket materials are known as CHOFORM. 

      7 reasons why form-in-place EMI gaskets can be an ideal choice
    1. Small form factor - form-in-place gaskets can be dispensed in smaller bead sizes than most traditional EMI shielding gasket solutions, 0.018” tall by 0.022” wide. 
       
    2. Excellent adhesion - 4-12 N/cm adhesion on prepared surfaces such as machined metals, cast housings, and electrically conductive plastics.
       
    3. High shielding effectiveness - Parker Chomerics CHOFORM materials can provide more than 100 dB shielding effectiveness in the 200 MHz to 12 GHz frequency range.
       
    4. Quick programming - Because form-in-place EMI gaskets are robotically dispensed, a standard CAD file can be used to program the dispensing system and quickly map out the dispensing pattern.
       
    5. Complex geometries - The positional tolerance of the gasket can be held to within 0.001” and is able to follow very complex geometries including sharp turns, corners, and serpentine patterns. Other gaskets such as die cut sheets or o-rings manufacture and/or fabricate into such shapes and patterns. 
       
    6. “T” joints - Traditional extruded gaskets are difficult to mate at intersections or “T” joints. The robot dispensing systems produce reliable junctions between bead paths to provide continuous EMI/EMC shielding and environmental sealing.
       
    7. Integrated solutions - CHOFORM technology combined with a Parker Chomerics supplied metal or conductive plastic housing provides an integrated solution ready for the customers’ highest level of assembly. This approach requires no additional assembly or process steps for the installation of gaskets and/or board-level auxiliary components. 
      Form-in-place EMI gasket limitations 
    1. Large form factor enclosure sealing that can accommodate a groove. For larger areas such as machined covers that can accommodate a gasket groove, other EMI shielding solutions are better suited. In most applications, conductive elastomers such as the CHO-SEAL product line by Parker Chomerics will provide better shielding and sealing. Form in place gaskets can be dispensed in bead sizes only as large as about 0.062” tall x 0.075” wide.
       
    2. Enclosures requiring submersion or durable weather sealing. Because of the small form factor, FIP gaskets will not meet stringent environmental sealing requirements such as IP 67 or higher. While silicone-based, the material is better at preventing dust and environmental moisture from entering an enclosure. FIP gaskets can be paired with additional sealing gaskets for enhanced weatherproofing. 
       

    Form-In-Place Gaskets: What They Are and What They Are Not - FIP Gasket Properties - Parker Chomerics


     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

    Form-In-Place Gaskets: What They Are and What They Are Not - Ben Nudelman - Parker ChomericsThis blog post was contributed by Ben Nudelman, market development engineer, Chomerics Division.

     

     

     

     

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    Sealing & Shielding Team
    Sealing & Shielding Team
    • 27 Nov 2019
    Form-In-Place Gaskets: What They Are and What They Are Not
    Form-in-place EMI gaskets, also known as FIP EMI gaskets, is a robotically dispensed electromagnetic interference (EMI)...
  • EMI and Environmental Sealing for Munitions_Missile_Parker CHomericsMaterial selection for military applications requires careful consideration, as there are strict requirements to ensure maximum durability, security and of course performance. In munitions, or missiles and missile launch systems, materials that provide electromagnetic interference (EMI) shielding and environmental sealing are critical for the functionality and field life of the application.

    Let's look at three areas of a munitions application -- specifically nose cones, cable shielding, and connectors, as each of these areas exemplify why EMI and environmental shielding are a necessity.

      Nose cones

    EMI and Environmental Sealing for Munitions Applications - Nose Cone - Parker ChomericsNose cones are what goes over the top of missiles, planes and other airborne technologies to assist with aerodynamics and to protect the electronic components inside. In missiles, all the electronics are stored within the nose cone and the fuel is held inside the canister. If these two parts are not properly shielded from each other, contamination can become a catastrophic event.

    Therefore, shielding the nose cone from EMI and other outside environmental dangers and shielding the components of the missile from each other is of utmost importance.

    Another threat to missile electronic malfunction is external tampering from malicious forces. Unintended or intentional EMI can result in misfires, false trajectory, and other problems. Often, anti-jammers are installed to help prevent this problem in combination with EMI shielding materials.

      Cable shielding

    Cable shielding is a woven fabric that goes over cables to prevent electromagnetic cross-talk between the cables and the components. Typically, a metal mesh is wrapped around the cables that will prevent any EMI from interacting with the cables or emitting from the cables.

    EMI and Environmental Sealing for Munitions Applications - Connector Gaskets - Parker Chomerics

    Different amounts of layers can be added to increase EMI shielding effectiveness, however adding more layers will also add more weight. Cable shielding that is lighter, typically non-metal based, is ideal for applications where weight is of concern like in munitions.

      Connectors

    Connectors are where wires are plugged into to keep electric circuits intact. In munitions, connectors can be a failure point because environmental agents can more easily enter which is why they require more attention to be shielded properly.

    The complexity of military electronics has increased significantly on air, sea and land-based applications. The environments in which systems are required to operate are often extreme. Design engineers need to consider wide variations in ambient temperature, shock and vibration, and electromagnetic interference (EMI).

    With a wide choice of shielding materials and a range of advanced shielded optical windows, Parker Chomerics helps ensure the protection of complex electronics from damage and compromised reliability caused by EMI.

    Sensitive electronic components can be kept within their operating temperature range limits by using heat management materials that include highly conformable, thermally efficient gap fillers and gels.

    Parker Chomerics offers the products, technical know-how, close customer support and supply chain capabilities to meet these challenges and deliver superior, reliable and cost-effective solutions.

     

     

    EMI and Environmental Sealing for Munitions Applications - Learn More - Parker Chomerics

     

     

     

     

    EMI and Environmental Sealing for Munitions ApplicationsThis blog post was contributed by Paige Ludl, marketing co-op, Chomerics Division.


     

     

     

     

     

    Related content:

    EMI Shielding Caulk Delivers Superior Performance in Military Radar Systems

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    Sealing & Shielding Team
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    • 26 Nov 2019
    EMI and Environmental Sealing for Munitions Applications
    Material selection for military applications requires careful consideration, as there are strict requirements to ensure...
  • Thermal Pads: Which Layer Do I Peel Off - Thermal Gap Pad - Parker ChomericsMost thermal pads, also known as thermally conductive gap filler pads, thermal gap pads, or thermal gap filler pads, have many different layer materials or carrier substrate options to choose from. It can be confusing which layer is supposed to stay on the product and which layer gets peeled off and removed before application. In fact, it’s one of our customer’s most asked about questions and can cause a lot of confusion on the manufacturing floor.

    So, which layer should you peel off and which should stay on the thermal gap pad? Read on to find out.

    Parker Chomerics, like many thermal gap pad vendors, offers several different gap pad layer options that must be peeled away before the gap pad is installed into the application. 

    Think of a thermal gap pad as a sandwich of layers -- there is always a blue poly backing that keeps the gap pad together, but there are five additional carrier substrate options which provide the following benefits:


    Thermal Pads Which Layer Do I Peel Off - Woven Glass - Parker ChomericsWoven fiberglass

    The woven fiberglass carrier option provides reinforcement and a clean break / low tack interface surface, allowing for re-use of the thermal pad if necessary or for prototyping.

    As you can see from the diagram, you peel off the liner to expose the woven glass carrier which does not get removed from the thermal gap pad.

    Example: THERM-A-GAP HCS10G.

      Thermal Pads Which Layer Do I Peel Off - Woven Fiberglass - Parker ChomericsAluminum foil with pressure sensitive adhesive (PSA) 

    The aluminum foil with PSA carrier’s primary function is to allow a pressure sensitive adhesive on the thermal gap pad to affix the thermal pad in place.

    As you can see from the diagram, you peel off the liner to expose the aluminum foil carrier which does not get removed from the thermal gap pad.

    Example: THERM-A-GAP A579.

     

    Thermal Pads Which Layer Do I Peel Off - PEN film - Parker ChomericsPolyethylenenapthalate (PEN) film 

    The polyethylenenapthalate (PEN) film carrier permits the thermal gap pad to see a shearing motion and offers a clear, cost-effective dielectric film with fair thermal performance.

    As you can see from the image at right, there is no clear film to peel off that exposes the PEN film carrier, which does not get removed from the gap pad.

    Example: THERM-A-GAP 579PN.

      Thermal Pads Which Layer Do I Peel Off - PEN film - Parker ChomericsThermally enhanced polyimide 

    The thermally enhanced polyimide carrier permits the thermal gap pad to see a shearing motion and offers an excellent dielectric film with enhanced thermal performance. 

    As you can see from the image at right, there is no clear film to peel off, the polyimide carrier does not get removed from the gap pad.

    Example: THERM-A-GAP 579KT.

      Thermal Pads Which Layer Do I Peel Off - No carrier - Parker ChomericsNo carrier   

    The no carrier or “un-reinforced” option allows the thermal gap pad to have high tack surfaces on both sides, allowing for the pad to be highly conformable, but it does make cutting and handling of the product more difficult.

    Once the liner is peeled back, there is no additional carrier on the thermal gap pad, the pad is now exposed.

    Example: THERM-A-GAP 579.

     

    Thermal Pads Which Layer Do I Peel OffBlue poly diamond carrier

    Lastly, the base carrier liner, shown in blue, is persistent on the bottom of all thermal gap pad options, and must be peeled and removed prior to installation of the thermal gap pad.

    This blue carrier is necessary, as it keeps the gap pad intact and more easily to handle prior to installation. We recommend keeping this blue poly carrier layer on just until the gap pad is placed for the final time.

     

     

     

    Thermal Pads Which Layer Do I Peel Off - Thermal Interface Materials Catalog - Parker Chomerics

     

     

     

     

     

     

     

    Thermal Pads Which Layer Do I Peel Off - Jarrod Cohen Author - Parker Chomerics

     

     

    This blog was contributed by Jarrod Cohen, marketing communications manager, Parker Chomerics Division.

     

     

     

     

    Related content:

    How to Identify Quality Thermal Gap Fillers in Four Steps

    The Four Best Thermal Interface Materials For Cooling Electronics

    Viscosity vs. Flow Rate - Which Is Best in Thermal Interface Materials?

    Sealing & Shielding Team
    Sealing & Shielding Team
    • 14 Nov 2019
    Thermal Pads: Which Layer Do I Peel Off?
    Most thermal pads, also known as thermally conductive gap filler pads, thermal gap pads, or thermal gap filler pads, have...
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